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Agenda - Council Work Session - 06/28/2022
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Agenda - Council Work Session - 06/28/2022
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Last modified
3/14/2025 2:33:49 PM
Creation date
6/24/2022 3:37:01 PM
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Meetings
Meeting Document Type
Agenda
Meeting Type
Council Work Session
Document Date
06/28/2022
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Contents <br /> Introduction 2 <br /> Asphalt pavement distress 3 <br /> Evaluation 4 <br /> Surface defects 4 <br /> Surface deformation 5 <br /> Cracking 7 <br /> Patches and potholes 12 <br /> Rating pavement surface condition 14 <br /> Rating system 15 <br /> Rating 10 & 9— Excellent 16 <br /> Rating 8—Very Good 17 <br /> Rating 7 —Good 18 <br /> Rating 6—Good 19 <br /> Rating 5— Fair 20 <br /> Rating 4— Fair 21 <br /> Rating 3 — Poor 22 <br /> Rating 2—Very Poor 23 <br /> Rating 1 — Failed 25 <br /> Practical advice on rating roads 26 <br /> This manual is intended to assist local officials in understanding and <br /> rating the surface condition of asphalt pavement. It describes types <br /> of defects and provides a simple system to visually rate pavement <br /> condition. The rating procedure can be used as condition data for the <br /> Wisconsin DOT local road inventory and as part of a computerized <br /> pavement management system like PASERWARE. <br /> The PASER system described here and in other T.I.C. publications is Copyright© 1987, 1989, 2002 <br /> based in part on a roadway management system originally developed Wisconsin Transportation Information Center <br /> by Phil Scherer, transportation planner, Northwest Wisconsin Regional 432 North Lake Street <br /> Planning Commission. Madison, WI 53706 <br /> Produced by the T.I.C. with support from the Federal Highway phone 800/442-4615 <br /> Administration, the Wisconsin Department of Transportation, and the fax 608/263-3160 <br /> University of Wisconsin-Extension. The T.I.C., part of the nationwide e-mail tic@epd.engr.wisc.edu <br /> Local Technical Assistance Program (LTAP), is a Center of the College URL http://tic.engr.wisc.edu <br /> of Engineering, Department of Engineering Professional Development, <br /> University of Wisconsin—Madison. f.04 Printed on recycled paper. <br />
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